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Mechanism for Si–Si Bond Rupture in Single Molecule Junctions

Author(s):

Haixing Li, Nathaniel T. Kim, Timothy A. Su, Michael L. Steigerwald, Colin Nuckolls, Pierre Darancet, James L. Leighton, Latha Venkataraman

Journal:

Journal of the American Chemical Society

Year:

2016

Volume:

138

Pages

16159-16164

DOI:

10.1021/jacs.6b10700

Abstract:

The stability of chemical bonds can be studied experimentally by rupturing single molecule junctions under applied voltage. Here, we compare voltage-induced bond rupture in two Si−Si backbones: one has no alternate conductive pathway whereas the other contains an additional naphthyl pathway in parallel to the Si−Si bond. We show that in contrast to the
first system, the second can conduct through the naphthyl group when the Si−Si bond is ruptured using an applied voltage. We investigate this voltage induced Si−Si bond rupture by ab initio density functional theory calculations and molecular dynamics simulations that ultimately demonstrate that the excitation of molecular vibrational modes by tunneling electrons leads to
homolytic Si−Si bond rupture.

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